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Memorandum of Understanding signed with Shanghai Lead Dynamic Engineering
09 November 2015


Kinetica and Shanghai Lead Dynamic Engineering have signed a Memorandum of Understanding to actively promote and to expand the Chinese market of the VCD technology for high-rise buildings over the next three years. Find further information in the press release.


Second from the bottom right - Dr. Constantin Christopoulos, President (Kinetica) and Bottom right - Masaki Nakajima, General Manager, Shanghai Lead Dynamic Engineering Inc.